Silicon Laboratories Si2415 Especificaciones descargar pdf (Pagina 54)

Si2457/34/15/04

54 Rev. 1.3

12. Package Outline: 24-Pin TSSOP

Figure 21 illustrates the package details for the Si2457/34/15/04 24-pin packaging option. Table 15 lists the values

for the dimensions shown in the illustration.

Figure 21. 24-Pin Thin Shrink Small Outline Package (TSSOP)

Table 15. Package Diagram Dimensions

Dimension Min Nom Max

A——1.20

A1 0.05 — 0.15

A2 0.80 1.00 1.05

b 0.19 — 0.30

c 0.09 — 0.20

D 7.70 7.80 7.90

E 6.40 BSC

E1 4.30 4.40 4.50

e 0.65 BSC

L 0.45 0.60 0.75

L2 0.25 BSC

θ 0° — 8°

aaa 0.10

bbb 0.10

ccc 0.20

Notes:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.

3. This drawing conforms to the JEDEC Solid State Outline MO-153,

Variation AD.

4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020

specification for Small Body Components.

1 2 ... 49 50 51 52 53 54 55 56 57 58 59 60

Sin comentarios

Silicon Laboratories Si2415 Especificaciones Pagina 54